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AuSn Pre-Deposited AlN Ceramic Substrates

As the submount for the heat dissipation of high-power diode laser chips, the AuSn pre-deposited DPC material is fabricated through metallization of AlN ceramic substrate and pre-deposition of micron-level AuSn thin film in specific areas. It is a key technology that ensures the long-term reliable use of optoelectronic devices.

AuSn Pre-Deposited CuW Substrates

As the submount for the heat dissipation of high-power diode laser bar chips, the AuSn pre-deposited CuW material is fabricated through pre-deposition of micron-level AuSn thin film in specific areas of copper-tungsten substrates. It is a key technology that ensures the long-term reliable use of optoelectronic devices.

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